Reduce the risk of hardware failure due to overheating.
Heatsink Size: 11.81" x2.71" x 1.41" / 300mm x 69mmx 36mm.
Widely used for computer, Power Transistor, FET, IC, Power Amplifier, Voltage Regulator, MOSFET, SCR etc.
Maximize surface area Designed in contact with the cooling air. The 27pcs fins increase the area of the board and thus provide for greater heat transfer
❀ Thermal Adhesive Tape is a simple and practical tape, easy to install, easy to use, easy to eliminate.
❀ Thermal tape with the high thermal conductivity, insulation, strong stickiness, softness, compression.
❀ EFFICIENT THERMAL CONDUCTIVITY - The Thermal Pad based on silicone & a special filler outperforms generic and performance pads by far. The Thermal Conductivity amounts to 2.0 W/mK.
❀ Thermal tape with the high thermal conductivity, insulation, strong stickiness, softness, compression. ✔Widely used in most electronic devices,High tensile strength and strong adhesion hold the device firmly in place, to achieve the most effective thermal dissipation
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